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한국어

MEMS product

MEMS foundry

design / fabrication / evaluation

fabrication

description

Implement customer-specific fab processes.
Such as Deposition, lithography, etching, bonding
We provide all semiconductor unit process and mass production test process.

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service detail

※ Provide customer-made order
Fabrication
Wafer Size 2"~6"
Deposition system :E-beam,LPCVD,PECVD,Sputter,ALD etc
Etch system ICP-DRIE,DRIE,wet-etch
Bonding type Wire, ball
Package type >TO, LCC

deposition

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deposition
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deposition
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deposition
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deposition

Lithography

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Lithography
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Lithography

etching

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etching
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etching
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etching
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etching

bonding

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bonding
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bonding
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bonding
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bonding
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bonding
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bonding
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bonding

device / package

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device / package
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device / package
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device / package
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device / package